As most of us might have know, the Galaxy S II for AT&T received a codename Samsung Hercules. The reason behind the change in processor is still unknown. We are hoping to hear more very soon.

[via AndroidCommunity]

As you can see above, the device is a candybar like design. It comes with 3.0″ WVGA display with a pixel density of 311ppi, an 800MHz Qualcomm MSM7227 SoC, 512MB of RAM, 5-megapixel camera, HSPA and Wi-Fi connectivity, Bluetooth 2.1, and IrDA. Priced at ¥29,800 and comes in white, black, and brown.

[via AndroidCommunity]

The handset features a very long 4.8-inch 21:9 aspect ration display. Although it has a long display, it is very thin and quite responsive. It also have HSDPA, Wi-Fi b/g/n, and Bluetooth 2.1+EDR. The device will cost you 499 Euro.

[via SlashGear]

The device will cost you $79.99 after a single $50 mail-in rebate with a two years agreement. It runs on Android 2.3 Gingerbread and features Sense 2.1. The device packed with a 600Mhz Qualcomm S1 single-core processor and a 3.2-inch 320×480 pixel TFT LCD display.

[via AndroidCommunity]

The handset features 4.7-inch WVGA Super LCD touchscreen, 8-megapixel back camera which support 720p HD video recording, 1.3-megapixel front-facing camera and 1.5GHz processor. Also inside you will see Qualcomm’s MSM8255 paired with 512MB of RAM and 16GB of internal storage.

Aside from all of those, there are HSPA+ with download speeds of 14.4Mbps and upload speeds of 5.76Mbps, network depending, along with WiFi b/g/n, Bluetooth 2.1+EDR and AGPS/GPS. It packed with An FM radio, DLNA support, G-sensor, digital compass and dual microphones. And of course, runs with Windows Phone Mango.

[via SlashGear]

It packed with 2.8-inches on 320 x 240 resolution as the main screen while below it, there’s a thin little OLED screen (96 x 16 resolution). The EX130 comes with 128MB of memory and 64MB of RAM. As for which network will the device be going remains unknown.

[via SlashGear]

He didn’t stop there. Kuo said the iPhone 5 will powered with A5 processor like the iPad 2 and Qualcomm chips. Aside for those, the camera size will be the exact same as the iPod Touch. He still believe Apple will officially announced the device on WWDC 2011. Followed by it’s production in August.

[via Pocket-lint]

Apparently, Microsoft is focusing on the user experience and battery life at this point, looking to extend the latter’s while in every day usage. And, just as we expected, Microsoft is currently working with several different companies out there for the launch date, which is going to be some time during the holiday season, this year. Microsoft Vice President, Terry Myerson, specifically named Qualcomm and Broadcom as chip manufacturers, while LG, HTC, and Samsung were all named as primary focuses for hardware manufacturers. As for carriers? We already know AT&T’s the premiere partner, but it looks like T-Mobile USA is also getting some Windows Phone 7 love, too, around launch.

We’ll have to wait and see if Microsoft’s gamble to start over, completely, with their mobile division is going to pay off. While the initial demonstrations of Windows Phone 7 were favorable, and many people loved the integration with other Microsoft-based products, like Xbox LIVE, we won’t get a firm grasp on what Microsoft is planning for the future until we can finally see a final build of software, and hardware. Hopefully that’s coming up soon.

[via Cnet]

The MSM7x30 family of chipsets, which includes the MSM7230 solution for HSPA+ networks and MSM7630 solution with multi-mode HSPA+/EV-DO Rev. B and SV-DO support, is designed around optimal data throughput and powerful multimedia functionality. The 7×30 uses an 800 MHz to 1 GHz custom superscalar CPU based on the ARM v7 instruction set, delivering  features that include:

• 720p high-definition video encode/decode at 30 frames per second
• Integrated 2D and 3D graphics GPUs with support for OpenGL ES 2.0, and OpenVG 1.1 industry standard APIs
• Dedicated low-power audio subsystem supporting 5.1 surround
• 12-megapixel camera support
• Integrated GPS for location-based services
• Support Android, Windows Mobile, Brew Mobile Platform and Symbian
• Support for package-on-package memory for reduced board space, optimized power consumption and more responsive performance

“Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry leaders to bring these advanced technologies to market,” said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. “We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”

Qualcomm is working with numerous network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and/or LTE solutions. Among multiple network operators evaluating the new technologies are Japan’s EMOBILE Ltd. and Telstra Wireless. Qualcomm is also working with multiple infrastructure vendors, such as Huawei Technologies and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE. Among the many device manufacturers currently evaluating the new chipsets are Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.

Qualcomm’s MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8 standard, provides peak downlink data rates of up to 42 megabits per second (Mbps) and 11 Mbps on the uplink, allowing carriers to easily upgrade their existing infrastructure equipment to achieve significantly higher bandwidths. Its dual-carrier technology doubles networks’ bandwidth from 5 MHz to 10 MHz by aggregating two HSPA carriers in parallel.

The MDM9200 and the MDM9600 chipsets are the industry’s first multi-mode 3G/LTE solutions that allow UMTS and CDMA2000® operators to upgrade seamlessly to future LTE services while preserving backward compatibility to their existing 3G networks. MDM9200 supports UMTS, HSPA+ and LTE, while the MDM9600 supports CDMA2000® 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE. All of the new chipsets support FDD LTE and TDD LTE modes and different carrier bandwidths, and are capable of using orthogonal frequency division multiple access (OFDMA) and multiple-input and multiple-output (MIMO) antenna technology to support peak data rates of up to 100 Mbps on the downlink and 50 Mbps on the uplink.