SlashPhone » Infineon http://www.slashphone.com Worldwide mobile phone news, reviews and wireless innovations Tue, 24 Nov 2009 14:15:21 +0000 http://wordpress.org/?v=2.8.6 en hourly 1 Infineon and Micron Develop Next-Generation Data Storage Solution for HD-SIM Cards http://www.slashphone.com/infineon-and-micron-develop-next-generation-data-storage-solution-for-hd-sim-cards-033038 http://www.slashphone.com/infineon-and-micron-develop-next-generation-data-storage-solution-for-hd-sim-cards-033038#comments Mon, 03 Nov 2008 14:51:06 +0000 Kim Poh Liaw http://www.slashphone.com/?p=3038 Infineon Technologies and Micron today announced a strategic technology collaboration for the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128 megabytes (MB). Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package.

sim-card

Combining high density with improved security functionality enables operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time to maintain fast time-to-market.

]]> http://www.slashphone.com/infineon-and-micron-develop-next-generation-data-storage-solution-for-hd-sim-cards-033038/feed 0 Samsung Picks Infineon Platform for HEDGE Phones http://www.slashphone.com/samsung-picks-infineon-platform-for-hedge-phones-24303 http://www.slashphone.com/samsung-picks-infineon-platform-for-hedge-phones-24303#comments Thu, 24 Apr 2008 08:37:46 +0000 Budi Putra http://www.slashphone.com/?p=303 You can enjoy the powerful Samsung HEDGE (HSDPA/EDGE) phone in the second quarter of this year. The Korean phone maker is just announcing a comprehensive family of HEDGE mobile phones that will employ the Infineon XMM 6080 HSDPA Platform.

The platform includes the HSDPA/EDGE baseband, power management, single chip 3.5G RF transceiver, video telephony, 3 chip solution (baseband, PMU, RF) and integrated 3GPP dual mode protocol stack Rel. 5.

Infineon Technologies says that its solution enables customers to significantly reduce their component count, footprint, complexity and cost of designs.

XMMTM 6080 Platform, as Infineod revealed in its website, is very compact dual-mode triband HSDPA 7.2 Mbit/s for 3.5G enabled feature phones.

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