Infineon Technologies and Micron today announced a strategic technology collaboration for the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128 megabytes (MB). Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package. continued »

You can enjoy the powerful Samsung HEDGE (HSDPA/EDGE) phone in the second quarter of this year. The Korean phone maker is just announcing a comprehensive family of HEDGE mobile phones that will employ the Infineon XMM 6080 HSDPA Platform. continued »