Infineon Technologies and Micron today announced a strategic technology collaboration for the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128 megabytes (MB). Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package.

Combining high density with improved security functionality enables operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time to maintain fast time-to-market.