Broadcom today announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on a low power, single 65 nanometer CMOS die.

The BCM21551 3G "Phone on a Chip" combines a high-speed HSUPA 3G baseband, a multi-band radio frequency (RF) transceiver, Bluetooth 2.1 with enhanced data rate (EDR) technology, an FM radio receiver and an FM radio transmitter (for car stereo music playback).

The device also features multimedia processing, up to five Megapixel camera support, and 30 frame per second video with "TV Out," as well as support for the HSUPA, HSDPA, WCDMA and EDGE cellular protocols.

"Broadcom has already demonstrated commercial success with its EGPRS single-chip solution and multi-chip 3G solutions," commented Michael Thelander, CEO and Founder of Signals Research Group, LLC. "With this single chip solution, Broadcom is becoming a one-stop supplier of 3G/2G, Wi-Fi and Bluetooth silicon solutions and communications software, positioning it to leapfrog many of its competitors from both a technology and market share perspective."

The BCM21551 3G baseband processor is available now to early access customers and is priced at $23.00 in large quantities.