Cypress Semiconductor Corp. today introduced a high-speed USB 2.0 transceiver available in the industry’s smallest package. The new MoBL-USB TX3LP18 transceiver is offered in a 20-pin WLCSP (Wafer Level Chip Scale Package) package that measures only 2.2 mm x 1.8 mm -- almost three times smaller than a standard golf ball dimple. This combination saves board space and prolongs battery-life for a wide range of portable applications such as mobile handsets, PDAs, PMPs, and GPS units.

In addition to its small size, the device integrates multiple passive components in order to further reduce boardspace usage and enable smaller end systems. It removes the need for a dedicated 3.3V power supply with a wide input supply voltage range from 3.0 to 5.8V, and features an integrated Phase-Locked Loop (PLL) to supply USB clocking requirements without a dedicated crystal.

The MoBL-USB TX3LP18 transceiver offers a wide array of features and functions, including:

• ULPI-compliant/USB-2.0-certified for device operation
• Supports both USB 2.0 high-speed (480 Mbits/second) and full-speed (12 Mbits/second)
• 8-bit Single Data Rate (SDR) ULPI Data Path
• Integrated regulator with 3.0 - 5.775V input
• 13, 19.2, 24 or 26 MHz reference for integrated PLL
• Support for industrial temperature range (-40C to 85C).