MagnaChip Semiconductor today announced the launch of a high-performance 3.2 megapixel CMOS image sensor (MC532MA) for the camera phone application market. The MC532MA operates at 12 frames per second (fps) at full-resolution and up to 30 fps at SVGA resolution. Special ADC and analog designs allow the sensor to achieve power dissipation below 150mw for full-resolution, full-frame rate operation. The 10-bit Bayer RGB output interfaces to all standard processors, and base-band solutions.

The 2.57u pixel of the MC532MA allows for excellent low-light performance in a small module size, which has typically been a trade off with solutions currently on the market. When implemented in an Auto Focus application, modules of 11x11x7mm or smaller can be achieved. This smaller size will enable OEMs to adopt high-resolution imaging across multiple handset models.

The sensor uses wide acceptance angle pixel technology, which helps to ensure minimum module height while maintaining the crucial corner performance. This new high-resolution CMOS image sensor offers high responsivity, low noise and image quality enhancing filters.

Jason Hartlove, Senior Vice President and General Manager of the Imaging Solutions Division of MagnaChip stated, "This is a very exciting launch for MagnaChip. The MC532MA offers unique value by enabling small size modules and superb low-light performance in a single solution. The MC532MA is the first of many high-resolution sensors from MagnaChip. By leveraging the best-in-class engineering teams we have in Korea, Japan, and the US, we expect to achieve considerable growth in our markets next year."

Mr. Hartlove continued, "The market for camera phones continues to grow more rapidly than the overall handset market. Resolutions continue to increase, closing the performance gap between the full-featured digital still cameras and the camera phone. We see devices like the 3.2MP MC532MA, as a strong indication of the resolution trends we should expect in the camera phone market."

Samples are now available of the 3.2 megapixel image sensor, with mass production expected to begin late in the first quarter of 2006.